Facilities

  • Physical Property Measurement System
    • Quantum Design PPMS-9 with EverCool Dewar
    • Magnetic field range: 0-9 Tesla
    • Temperature range: 1.8-400 Kelvin
    • DC Transport
    • AC Transport
    • Horizontal Rotator
    • Heat Capacity
    • Torque Magnetometry
    • Point contact spectroscopy
    • Fast resistive measurements with current ramping rate up to 300A/s
    • High pressure resistive measurements (up to 15 GPa)
  • High Pressure Experiment System
    • Pcell 30 Cell (up tp 3 GPa) & Ppress
    • CryoDAC PPMS Diamond Anvil Cell (up to 15~20 GPa) 
    • Optiprexx PLS Pressure Measurement Instrument
    • MCell (up to 1.2GPa) (ANL, MPMS)
    • Diamond Anvil (15 GPa) (ANL, MPMS)
  • Gas Sensor Test System
    • Computer controlled
    • Hydrogen concentrations: 0.001%-100%
    • Sample temperatures: -40 oC ~ +300 oC
  • Glove Boxes
  • Vacuum Atmosphere Company (VAC) OMNI-LAB
    • Vacuum Atmosphere Company (VAC) OMNI-LAB
    • < 1 PPMO2 and H2O
  • Vapor Desposition and Crystal Growth Systems 
    • Lindberg 3-zone furnaces (up to 1100ºC)
    • Lindberg 1-zone furnaces (up to 1100ºC)
    • Lindberg box furnaces (up to 1700ºC)
  • Anodization Systems
    • NESLAB RTE10 Refrigerated Bath
    • Agilent E3612A Power Supplies (0-60V/0-0.5A; 0-120V/0-0.25A)
    • hp 6115A Precision Power Supply (0-50V/0-0.8A; 50-100V/0-0.4A)
  • Thin Film Deposition System
    • Home-built UHV Magnetron Sputtering System
    • Vacuum Evaporator   
  • High Energy Ball Milling
    • Equipped with safety interlock system for operator protection
    • Grinding samples in the 0.2 - 10 gram range or mixing up to 60 mL of sample
    • Variable-range electronic timer is factory-set for 100-minute range
    • Grinding and mixing vials available including stainless steel, tungsten carbide
  • Micromanipulator
    • REL-4100A Optic Microscope  
    • BK Precision 1686A DC Regulated Power Supplies
  • Scanning Electron Microscope (ANL/EMC, operator)
    • Hitachi S-4700 FE-SEM
  • Lithography Tools (ANL/CNM, user)
    • Optic lithography (Karl Suss MA6)
    • Electron-beam lithography (Raith 150)   
  • Focused-ion-beam (FIB) System (ANL/EMC, user)